Column counts of 4, 6 and 8 allow for sizing the connector to the required differential pair count. 4, 6 or 8 columns. Copper Weight and Annular Ring (“A/R”) 7 Table 2: XCede® HD and XCede® HD Plus 17. Farnell Israel offers fast quotes, same day dispatch, fast delivery, wide inventory, datasheets & technical support. XCede® HD结合了小巧的外形和优异的设计灵活性，实现了电路板和系统空间的大幅节省。系统的模块化使设计师能够借助可选电源模块、导引和锁合以及侧壁来打造出完全定制的背板解决方案，从而提高耐用性。 XCede Plus leverages the same core technologies as XCede with improved signal integrity performance while maintaining backwards mating interface compatibility with existing XCede products. Español $ USD United States. 80mm Right-Angle Backplane Receptacle; HDTF-6-08-S-RA-LC-100; HDTF - Samtec XCede® HD 1. The XCede backplane connector system provides mechanical longevity and ruggedness required by today’s systems. XCede® Stacker. Improves signal integrity and increases signal. XCede® connectors also address. XCede ® HD Plus. These connectors are two-piece devices that connect two printed circuit boards. 5-inch backplane 1. 28G ADDITION TO THE XCEDE ® HD FAMILY XCede ® HD plus leverages the same. Choice of 2 or 4 power banks. refer to c-922-4x0a-500 for signal connector detail. 4. 下载3D模块 配置并加入到购物车 配置免费样品 技术参数. Login or REGISTER Hello, {0}. Board-to-board connector / rectangular / SMT. TB-2253 XCede HD Family Daughtercard Wafer Removal and Replacement. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. XCede HD, XCede HD PLUS & XCede HD2 press fit backplane connector family onto a printed circuit board (PCB). 2. 1. § Differential pairs 28-84 per inch (11-33 differential pairs perAmphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 5 application, evolved up to the further PCIe Gen. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. We offer interconnection systems from 2. 1. English Deutsch Français Español Português Italiano Român Nederlands Latina Dansk Svenska Norsk Magyar Bahasa Indonesia Türkçe Suomi Latvian Lithuanian česk. Up to 3. . Signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. $19. The system’s modularity gives designers the opportunity to create a fully custom backplane solution with optional power modules, guidance. 信号端子上可实现高达3. Article: 00229048. 1. 1. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Other items. Attention! Your ePaper is waiting for publication! By publishing your document, the content will be optimally indexed by Google via AI and sorted into the right category for over 500 million ePaper readers on YUMPU. We would like to show you a description here but the site won’t allow us. This type of cable is suitable for high-density networks and can reach a much longer distance than DAC and AOC. BENEFITS. XCede. XCede Plus Backplane Connector. . 00 mm的触点滑动范围. 2. 0225" Drill Compliant Pin Protrusion (mm) (negative numbers result in no protrusion) 0. Part # dimensions for each XCede connector type. XCede® connectors also address. 0 TOOLING 1. DETAILS. DESIGNED TO ACHIEVE 56G DATA RATE REQUIREMENTS WITH HIGHER DENSITY While maintaining the same mating interfaces with XCede ® HD and XCede ® HD Plus, this connector provides developers with a readily available robust solution for tighter card pitches and chassis. Combination signal and power edge card system with rugged Edge Rate® contacts and performance up to 60 A per power bank. Login or REGISTER Hello, {0}. XCede PRODUCT FAMILY DAUGHTERCARD MODULE REMOVAL AND REPLACEMENT . Buy Amphenol JX41051436 in Avnet APAC. Integrated Circuits IGBTs MOSFETs Discrete Semiconductors RF and Microwave Passives Motors & Actuators Microphones & Speakers Connectors Electronic Materials Thermal Management. 00 mm contact wipe on signal pins. The 0. Change Location. Modular design provides flexibility in applications. FEATURES. Brand of Product：Amphenol ICC,Part#：946-210X-13X,Product Category：EXTENDED RAM MODULE,Data Type：Outline Dimension Drawing. 4. The XCede HD® connector leverages the same core technologies as standard XCede®, providing a robust solution for tighter card pitches and chassis designs where space requirements and density are critical. Description. Receptacle connectors and pin connectors are through hole devices with eye-of-the-needle compliant pin contacts. Article: 00028492. Skip to Main Content +49 (0)89 520 462 110. High-speed, high-density backplane systems include ExaMAX ® and XCede ® HD in a variety of pair and column counts. 1. Here's a hint for each of the word groups in today's Connections puzzle, plus a couple more clues to help you find the answer:. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 4, Gen. 2. XCede® connectors also address. 2. If you need to add wires, there is an additional cost: please contact us and we will help you get the order processed. 99. The XCede HD® connector leverages the same core technologies as standard XCede®, providing a robust solution for tighter card pitches and chassis designs where space requirements and density are critical. Skip to Main Content (800) 346-6873. Receptacle connectors and pin connectors are through-hole devices with eye-of-the-needle compliant pin contacts. Amphenol TCS XCede® Backplane Connectors are designed to offer readily available 85Ω and 100Ω solutions while maintaining the same mating interfaces. XCede HD achieves the highest performance in an HM compatible form factor. XCede® connectors also address. TARGET MARKETS. 20mm Power Modules. EN. 08mm pitch sizes, this single-row, wire-to-board and board-to-board product family is cost effective and versatile. XCede HD2 backplane interconnect system. The series offers mechanical. View Substitutes & Alternatives along with datasheets, stock, pricing and search for other Backplane Connectors products. signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. DC configurations may also be determined by the XHD2 RAM connector to which they will mate for co-planar applications. DESIGNED TO ACHIEVE 56G DATA RATE REQUIREMENTS WITH HIGHER DENSITY While maintaining the same mating. 2. power connector (J_PWR_A) 6. Click OK to extend your time for an additional 30 minutes. SCOPE Content This specification covers the performance, test and quality requirements for XCede product family interconnect systems. EspañolAmphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Login or REGISTER Hello, {0}. A HIGH-DENSITY, DIFFERENTIAL, LOW-COST CONNECTOR SOLUTION FOR DATA RATES UP TO 14 GBPS. XCede® connectors also address. TARGET MARKETS. This connector ships without wires, terminals and seals. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. XCede® connector family. Download M12 PCB MOUNT CONNECTOR, X-CODED, FEMALE. Integrated power and guidance. XCede® connectors also address requirements for high linear signal density at the backplane. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. § Differential pairs 28-84 per inch (11-33 differential pairs perAmphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Mouser offers inventory, pricing, & datasheets for Amphenol Xcede Series High Speed/Modular Connectors. Farnell Israel offers fast quotes, same day dispatch, fast delivery, wide inventory, datasheets & technical support. Typically, XCede compliant pins will require an insertion force of 2-10 lbs/pin. 11. Formed in 2020 by a merger of three well. The inserts can be installed as per the. 2. The XCede product family encompasses XCede, XCede Plus, and X2 product lines, and their corresponding product derivatives including; daughtercard, backplane, mezzanine,. 2 The daughtercard connector building blocks include signal modules, power modules,. Login or REGISTER Hello, {0}. The XCede ® HD Plus backplane connector achieves high . 2. Integrated guidance, keying and polarizing side walls available. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD Plus connector meets the high-density needs of today's challenging architectures. The system’s modularity gives designers the opportunity to create a fully custom backplane solution with optional power modules, guidance. element14 Malaysia offers special pricing, same day dispatch, fast delivery, wide inventory, datasheets & technical support. Features. developers with a readily available robust solution for tighter card pitches and chassis designs where space requirements and density are critical. Available in industry-standard 2. 1. 2. Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions. Integrated Circuits IGBTs MOSFETs Discrete Semiconductors RF and Microwave Passives Motors & Actuators. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed, serial data rate requirements demanded by next-generation equipment in data centers and service. Typical applications include communications and data such as hubs, switches, routers, wireless infrastructure, servers, external storage systems, and more. Power blades rated up to 60 A per power bank. Pitch (mm): Mated Height (mm): Circuits: Current (MAX): 2. XCede® connectors also address. Complementary guide and power modules are also included in the product range. XCede® HIGHdPERFORMANCE BACKPLANE CONNECTOR. Contact us today for more details of XCede HD, part number 970301YD2B. Integrated power and guidance. 8 mm, Receptacle, Press Fit. The vertical header range also includes. Revision “F” Specification Revision Status . XCede® Family Cable Assemblies MATERIAL §§Contacts: High performance Copper Alloy §§Plating(s): Performance-based plating at separable interface (Telcordia GR-1217-CORE) §§Housings: High Performance Thermoplastic, UL94-V0. Contact Mouser (Bangalore) 080 42650011 | Feedback. Skip to Main Content. Formed in 2020 by a merger of three well. We are excited to announce the completion of a merger with TechStream and Etonwood as of Friday the 17th of January 2020. We work with businesses, from pioneering start-ups to global brands, to find project-based or permanent talent that enables innovation in line with their vision and goals. This website uses cookies to improve your experience while you navigate through the website. Receptacle connectors and pin connectors are through-hole devices with eye-of-the-needle compliant pin contacts. English Deutsch Français Español Português Italiano Român Nederlands Latina Dansk Svenska Norsk Magyar Bahasa Indonesia Türkçe Suomi Latvian Lithuanian česk. Nov 13, 2019. The XCede daughtercard connector can be assembled using individual segments up to 8” in length (8 inches for 2, 3, and 4 pair connectors and 6 inches for 5 and 6 pair connectors), and segments may be joined after individual pressing to total over 18” in length. Amphenol Communications Solutions. 3. Meets the high density needs of today's designs. These connectors are two-piece devices that connect two printed circuit boards. ENABLING FUTURE DATA RATES While maintaining the same mating interfaces, this connector design provides. Integrated Circuits IGBTs MOSFETs Discrete Semiconductors RF and Microwave Passives Motors & Actuators Microphones & Speakers Connectors Electronic Materials Thermal Management LCD&LED Displays Automation & Control Power & Batteries Test & Measurement Mechanical and Metal Parts Tools;. XCede® connectors also address. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. XCede HD PLUS & XCede HD2 daughtercard single wafer replacement. B S4329 Added XCede HD PLUS backplane information B. BAcKpAneL connectors Fci’s Xcede® connector platform is designed for 20+ Gb/s performance to provide the headroom to support future high-speed, serial data rate requirements demanded by next-generation equipment in data centers and service provider networks. Integrated Circuits IGBTs MOSFETs Discrete Semiconductors RF and Microwave Passives Motors & Actuators Microphones & Speakers Connectors Electronic Materials Thermal Management LCD&LED Displays Automation & Control Power & Batteries Test. EIA-364-B Electrical Connector Test Procedure Including Environmental Classifications 2. Features. EN. Click to download Certificate of. 0” Long. XCede® connectors also address. These connectors are two-piece devices that connect two printed circuit boards. DC connector configurations are determined by the customers’ system application. Xcede Group is a global recruitment organisation that delivers technology and energy talent solutions which enable companies to innovate and grow. Up to 82 differential pairs. 3、4和6对设计. DDR SDRAM - Evolution of High-Performance Volatile Memory. FCI released XCede vertical backplane headers and right-angle daughter card receptacles designed for 25 Gb/s performance. Female pin. 85. Multiple signal/ground pin staging options. 3A per pin current rating and mount individually to the backplane. 2 Reference Documents TB-2235 XCede HD General Product Specifications TB-2237 XCede HD Routing Guidelines TB-2252 XCede HD Backplane Connector Installation 2. 7. Additional RAM allows a computer to work with more information at the same time, which usually has a considerable effect on total system. power connector (J_PWR_B) 7. Please confirm your currency selection:2. XCede ® HD is a small form factor system with a modular design for significant space savings and. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. See section 4 regarding XHD+ RAM connectors. XCede HD & XCede HD PLUS press fit backplane connector family onto a printed circuit board (PCB). ExaMAX® enables up to 56 Gbps performance and allows designers the option to optimize density or minimize board layer count. asm jx410-51594_bp. 7. XCede® Connectors - Amphenol CS | DigiKey2020 Dodge Ram 1500 TIPM Module Connector (G36C42) TIPM Module Connector (G36C42) (3) List Price. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. use keep out zone. Combination signal and power edge card system with rugged Edge Rate® contacts and performance up to 60 A per power bank. The XCede product family encompasses XCede, XCede Plus, and X2 product lines, and their corresponding product derivatives including; daughtercard, backplane, mezzanine, right-angle-male (RAM), orthogonal, right-angle-male direct-attach orthogonal (RAM DA ortho. 0 REFERENCE 2. Luxshare-TECH Gen-Z provides the full range of configuration: 1C，2C，4C，4C+，8C and HP (. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Features & Benefits. For optimal connector configuration, connectors are grouped into signal modules of 4,. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. - FCI. 0177" drill, nano ni, std gold 1. 2. 4 differential signal pairs/inch. Mouser offers inventory, pricing, & datasheets for XCede High Speed/Modular Connectors. Four-pair connectors provide 54. Connector & Configuration Pair Size Product type Columns XCede HD Backplane 3 4 6 8 12 14 24 15 22 30 40 44 Vertical Header Signal Vertical Header Signal Vertical Header Signal Standard Enhanced Enh Gen 2 Vertical Receptacle Power R/A Header Power R/A Receptacle Guide ModuleXCede High Speed / Modular Connectors are available at Mouser Electronics. 80 mm高密度背板垂直插头. See section 4 regarding XHD2 RAM connectors. . See section 4 regarding XHD2 RAM connectors. PDF 957-4100-AXX 4 PAIR POWER. Each ball and socket mount is designed and manufactured using the highest quality materials, and is backed by a lifetime warranty. was founded in 1987 with the mission of becoming a specialty connector manufacturer, delivering highest quality products and providing unparalleled customer service. See section 4 regarding XHD2 RAM connectors. XCede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. Farnell Ireland offers fast quotes, same day dispatch, fast delivery, wide inventory, datasheets & technical support. Figure A-9 shows this requirement pictorially. Two press-fit sizes, (standard and small) provide board layout options for designers. Connections hint for November 24. XCede ® High-Performance Backplane Connector System. High-speed, high-density backplane systems include ExaMAX® and XCede® HD in a variety of pair and column counts. Amphenol TCS XCede Backplane Connectors feature up to 82 differential pairs as well as 2-, 3-, 4-, 5-, and 6-pair configurations. Newark offers fast quotes, same day shipping, fast delivery, wide inventory, datasheets & technical support. The connectors are intermatable, electrically and mechanically interchangeable. Brand of Product：Amphenol ICC,Part#：946-200X-13X,Product Category：EXTENDED RAM MODULE,Data Type：Outline Dimension Drawing. Vertical or Right Angle. Up to 82 differential pairs. 80 mm column pitch. Resource The top level of the. backplane to expander board connector (BP_XCEDE_31) 4. Newark offers fast quotes, same day shipping, fast delivery, wide inventory, datasheets & technical support. Integrated Circuits IGBTs MOSFETs Discrete Semiconductors RF and Microwave Passives Motors & Actuators Microphones & Speakers Connectors Electronic Materials Thermal Management. EN. Search. 4. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. XCede® connectors also address. challenging architectures. Login or REGISTER Hello, {0}. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Available in straddle mount, through-hole termination and also SMT. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with cooling. English. It is intended to provide general guidance for development of customer designs It is intended to provide general guidance for development of customer designs and application processes as they relate to this product family. Available for SOLIDWORKS, Inventor, Creo, CATIA, Solid Edge, autoCAD, Revit and many more CAD software but also as STEP, STL, IGES, STL, DWG, DXF and more neutral CAD formats. A wafer organizer can be used to combine groups of right-angle signal, guidance and power modules as an integrated daughter-card connector. Pin header. We would like to show you a description here but the site won’t allow us. 10119128-B0C-40DLF Datasheets | Backplane Connectors - Specialized Connector Header, Male Pins and Blades Through Hole Black XCede®, Guide Left By apogeeweb, 10119128-b0c-40dlf, 10119128-b0c-40dlf datasheet,10119128. Buy 928-4000-A7H - Amphenol Communications Solutions - Connector, 4 Diff Pair, XCede HD Series, Receptacle, Press Fit. View in Order History. XCede® connectors also address. Connectors with six differential pairs per column fit 36 mm minimum card slot pitch and provide 82. 4 differential pairs/inch. Login or REGISTER Hello, {0}. 4, 6 or 8 columns. 6. XCede® Family Cable Assemblies MATERIAL §§Contacts: High performance Copper Alloy §§Plating(s): Performance-based plating at separable interface (Telcordia GR-1217-CORE) §§Housings: High Performance Thermoplastic, UL94-V0. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 384 likes · 6 talking about this · 259 were here. Random Access Memory, or RAM (pronounced as ramm ), is the physical hardware inside a computer that temporarily stores data, serving as the computer's "working" memory. EspañolDownload XCede® Right Angle Receptacle 4-pair 8 column. TARGET MARKETS. 20mm HPTS Power Modules feature press-fit tails, vertical mounts, and come in a variety of body heights to match signal module pair count. XCede High Speed/Modular Connectors are available at Mouser Electronics. 三个等级的上电次序实现了热插拔. Same mechanical benefits as backplane connectors; High pin counts, blind mate & high density; Low loss twin ax cable; Overcomes limitation of PCB materials; Linear transmission to ~30 GHz; Enables 25G NRZ and 56G PAM4; Flexible pin out; Allows for full mesh designs with cable harnesses; 30 - 26 AWG wire gauges; Optimization of transmission and. Applications. Login or REGISTER Hello, {0}. Contact Mouser (USA) (800) 346-6873 | Feedback. This card can be used in an ITX system with an M. Get a Free Sample. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. These connectors are ideal for meeting a wide variety of application needs, including Ethernet and PCI. . Features. 12 - 48 pairs. . 0 DEFINITIONS 4. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. $ 129. Dislaime Please note that the above information is subect to change without notice. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Amphenol is one of the leading manufacturers of Connectors. Español $ USD United States. The XCede ® HD Plus backplane connector achieves high performance (up to 28+ Gb/s) in a Hard Metric form factor. For XCede HD RAM. XCede Connectors are available at Mouser Electronics. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Sloan 2-09-09 “A” S1979 Updated procedure, and addition of RAM and Stacker M. by Xcede. Subscribe news. XCede® connectors also address. Newark offers fast quotes, same day shipping, fast delivery, wide inventory, datasheets & technical support. Contact Mouser (USA) (800) 346-6873 | Feedback. XCede® HD combines a small form factor with incredible design flexibility for significant board and system space savings. 3-, 4- and 6-pair designs. Login or REGISTER Hello, {0}. XCede® Connectors - Amphenol CS | DigiKeyFounded in 2003, our vertical specialists provide global transformational talent in data, product, software, cloud and cyber. developers with a readily available robust solution for tighter card pitches and chassis designs where space requirements and density are critical. 4、6或8列. Amphenol is one of the leading manufacturers of Backplane connectors. See Figure 15 for details. a SFP+ adapter that's super-short 3. Guidance and keying options. 80 mm column pitch. English. Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions. 00mm pitch (FF5026) and 050mm pitch (FF3025). XCede® Family Cable Assemblies MATERIAL §§Contacts: High performance Copper Alloy §§Plating(s): Performance-based plating at separable interface (Telcordia GR-1217-CORE) §§Housings: High Performance Thermoplastic, UL94-V0. Pitch (mm): Mated Height (mm): Circuits: Current (MAX): 2. Board-to-board connector / right-angle / female The XCede® Right-Angle Male (XCede® RAM) connector is an intelligent device that offers two options for designers. XCede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card, providing up to 82. Vertical backplane header configurations provide two, four or six differential signal pairs per column wafer with four, six or eight wafers per signal connector module. 3-, 4- and 6-pair designs. XCede® connectors also address Xcede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. The SMA (or Sub-Miniature A) connector has a 50Ω impedance and can handle frequencies up to 17 GHz. The XCede ® I/O connector supports next generation 100G+ applications and. The XCede HD interconnect platform also has available RAM (Right Angle Male). Select language:Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. DC configurations may also be determined by the XHD2 RAM connector to which they will mate for co -planar applications. 4, 6 or 8 columns. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Login or REGISTER Hello, {0}. 4 differential signal pairs per inch are provided corresponding to a minimum slot spacing of 36 mm. Mouser offers inventory, pricing, & datasheets for Amphenol XCede HD Series Backplane Connectors. XCede® Backplane Connector MATERIAL §§Housing: Liquid Crystal Polymer §§Contact Base Metal: Copper Alloy §§Plating: Performance-based plating at separable interface; meets requirements of product specification ELECTRICAL PERFORMANCE §§Signal Current Rating: 1A per contact §§Ground Current Rating: 2A per contactJ-Tech, Inc. QSFP+ 40G transceiver with MTP/MPO connector; MTP/MPO 12 Fiber Trunk Cable. Dislaime Please note that the above information is subject to change without notice. 54mm pitch down to 0. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Accessories; Audio Products; CapacitorsAmphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 2. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede ® HD Plus connector meets the high density needs of today's challenging architectures. Lukin 10/01/13 “C” “D”. 2. Accepts 1. Up to 3. PCIe Gen. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 3-, 4- and 6-pair designs. Upload your CV. Founded in 2003, our vertical specialists provide global transformational talent in data, product, software, cloud and cyber. 1. XCede® connectors also address. Amphenol Communications Solutions XCede high-performance backplane connector system. 00: L: Pressfit: 5: Power or coax contacts, Multi Purpose Centre, Location Peg1. XCede® BACKPLANE CONNECTOR SYSTEM DESCRIPTION XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. XCede® connectors also address. FEATURES. Connectors; Diodes & Rectifiers; Embedded Processors & Controllers; Embedded Solutions; EMI/RFI Components; Enclosures;XCede High Speed / Modular Connectors are available at Mouser Electronics.